SEOUL -- The role of substrates in power electronics is to provide interconnections to form an electric circuit, and to cool components. Such substrates must carry higher currents and provide higher voltage isolation. Direct bonded copper (DBC) substrates are commonly used in power modules, because of their very good thermal conductivity.
DBC substrates are composed of a ceramic tile with a sheet of copper bonded to one or both sides by a high-temperature oxidation process. Ceramic materials used in DBC include alumina (Al2O3), which is widely used because of its low cost, and aluminum nitride (AlN), which is more expensive but has far better thermal performance.
KCC, a top provider of construction materials and paints in South Korea, has developed a high-strength substrate based on AIN ceramic called "H-AIN DCB" that has thermal conductivity more than six times higher than alumina-based DCB products by discovering an optimal mixing ratio after countless trials and errors.
H-AIN DCB allows semiconductor devices to operate efficiently for a long time by rapidly discharging heat, KCC said, adding the product has advantages in both thermal conductivity and strength. "In order to find the optimal mixing ratio that can improve strength while minimizing the decrease in thermal conductivity, we have finally achieved success through strenuous research, failures and re-challenges," an unnamed KCC official said in a statement on September 28.
KCC is confident over its product, saying it will receive good responses from clients. The company would help customers optimize their production conditions when carrying out new projects with H-AlN DCB.
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